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smsc emc1212 datasheet revision 1.1 (02-07-07) datasheet product features emc1212 bbus compliant dual temperature monitor with beta compensation general description the emc1212 is a tem perature sensor that communicates with a host over a single-wire smsc budgetbus? sensor interface. the emc1212 monitors one internal diode and one remote temperature zone. packaged in a sot23-5, the emc1212 provides an accurate, low-cost, low-current, solution for critical temperature monitoring in applications such as embedded systems or comp uters. when used in combination with an smsc super i/o host, such as a keyboard controller, a complete thermal management system is created. a power down mode extends battery life in portable applications. the internal 11-bit sigma delta temperature-to-digital converter provides superb linearity, high accuracy and excellent noise immunity. the emc1212 is designed to operate with 65nm or 90nm pnp substrate transistor used as a thermal diode with the collector co nnected to ground. applications ? desktop and notebook computers ? hardware management features ? single wire bbus interface ? resistance e rror correction ? beta compensation ? external temperature monitor ? 0.125c resolution ? 1c accuracy 60c to 100c ? diode fault reporting ? internal temperature monitor ? range 0c to +85c ? 0.125c resolution ? 1.5c accuracy 50c to 70c ? supply: ? 3.0v to 3.6v ? <5ua in standby simplified block diagram emc1212 temperature registers bbus interface local temp diode switching current dp 11-bit delta-sigma adc dn bbus beta comp & rec analog mux and anti-aliasing filter
order number(s): EMC1212-AGZQ-TR for 5 pin, sot lead-free rohs compliant package reel size is 2,500 pieces evaluation board available upon request (evb-kbc1100) 80 arkay drive, hauppauge, ny 11788 (631) 435-6000, fax (631) 273-3123 copyright ? 2007 smsc or its subsidiaries. all rights reserved. circuit diagrams and other information relati ng to smsc products are included as a means of illustrating typical applications. consequently, complete information sufficient for construction purposes is not necessarily given. although the information has been checked and is believed to be accurate, no re sponsibility is assumed for inaccuracies. smsc reserves the right to make changes to specifications and product descriptions at any time without notice. contact your local sm sc sales office to obtain the latest specifications before placing your product order. the provision of this information does not convey to the purchaser of the described semicond uctor devices any licenses under any patent rights or other intellectual property rights of smsc or others. all sales are expressly conditional on your agreement to the te rms and conditions of the most recently dated version of smsc's standard terms of sale agreement dated before the date of your order (the "terms of sale agreement"). the pro duct may contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. anomaly sheets are availab le upon request. smsc products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property damage. any and all such uses without prior written approval of an officer of smsc and further testing and/or modification will be fully at the risk of the customer. copies of this document or other smsc literature, as well as the terms of sale agreement, may be obtained by visiting smsc?s website at h ttp://www.smsc.com. smsc is a registered trademark of standard microsystems corporation (?smsc?). produc t names and company names are th e trademarks of their respective holders. smsc disclaims and excludes any and all warra nties, including without limitation any and all implied warranties of merchantabil ity, fitness for a particular purpose, title, and against infringeme nt and the like, and any and all warranties arising from any cou rse of dealing or usage of trade. in no event shall smsc be liabl e for any direct, incidental, indi rect, special, punitive, or cons equential damages; or for lost data, profits, savings or revenues of any kind; regardless of the form of action, whether based on contrac t; tort; negligence of smsc or others; strict liability; breach of warranty; or otherwise; whether or not any remedy of buyer is h eld to have failed of its essential purpose, and whether or not smsc has been advised of the possibility of such damages. bbus compliant dual temperature monitor with beta compensation datasheet revision 1.1 (02-07-07) 2 smsc emc1212 datasheet
bbus compliant dual temperature monitor with beta compensation datasheet smsc emc1212 3 revision 1.1 (02-07-07) datasheet chapter 1 pin description figure 1.1 pin diagram for emc1212 table 1.1 pin description pin number name function 1 vdd supply voltage 2 gnd ground 3 bbus serial bus interface to smsc host 4 dp remote diode positive terminal 5 dn remote diode negative terminal 5 4 1 2 3 vdd gnd bbus dn dp
bbus compliant dual temperature monitor with beta compensation datasheet revision 1.1 (02-07-07) 4 smsc emc1212 datasheet chapter 2 electrical specifications 2.1 absolute maximum ratings note: stresses above those listed could cause damage to the device. this is a stress rating only and functional operation of the device at any other condition above those indicated in the operation sections of this specification is not implied. when powering this device from laboratory or system power supplie s, it is important that the absolute maximum ratings not be exceeded or device failure can result. some power supplies exhibit voltage spikes on their outputs when the ac power is switched on or off. in addition, voltage transients on the ac power line may appear on the dc output. if this po ssibility exists, it is suggested that a clamp circuit be used. 2.2 electrical specifications vdd = 3.3v 10% t a = 0c to 85c, all typical values at t a = 27c unless otherwise noted. table 2.1 emc1212 maximum ratings description rating unit supply voltage v dd -0.3 to 5.0 v voltage on any other pin to gnd -0.3 to v dd +0.3 v operating temperature range 0 to 85 c storage temperature range -55 to 150 c lead temperature range refer to jedec spec. j-std-020 package thermal characteristics for sot23-5 power dissipation tbd thermal resistance(at 0 air flow) 131.7 c/w esd rating, all pins human body model 2000 v characteristic symbol min typ max unit conditions dc power supply voltage v dd 33.33.6v supply current i dd 700 1000 ua active mode supply current i dd 2 5 ua standby mode internal temperature monitor temperature accuracy 1 3 c 1.5 c 50c < t a < 70c temperature resolution 0.125 c
bbus compliant dual temperature monitor with beta compensation datasheet smsc emc1212 5 revision 1.1 (02-07-07) datasheet 2.3 budgetbus electr ical characteristics v dd = 3v to 3.6v, t a = 0c to 85c, typical values are at t a = 27c unless otherwise noted. 2.4 budgetbus protocol the emc1212 communicates with a host controller, such as the smsc kbc1100, through the proprietary single wire smsc budgetbus? sensor interface known as bbus. the bbus is a single wire serial communication protocol between the comput er host and its peripheral devices. please refer to the bbus specification for detailed in formation about the modes of operation. the budgetbus timing is shown in figure 2.1 . this timing applies to all budgetbus communication bits. external temperature monitor temperature accuracy 0.5 1 c 60c < t diode < 100c, 10c < ta < 70c 1 3 c 0c < t diode < 125c temperature resolution 0.125 c conversion time per channel t conv 21 ms capacitive load c load 400 pf connected across remote diode characteristic symbol min typ max units conditions output high voltage v oh 2.4 v 2ma sourcing current output low voltage v ol 0.4 v 4ma sinking current input high voltage v ih 2.4 v input low voltage v il 0.4 v ac parameters input capacitance c in 10 pf bus single bit high time or low time t high / t low 81012us inactive time t inactive 132 us between consecutive packets or after power up power down time t pwrdn 264 us to initiate power down rise time t rise 400 ns fall time t fall 400 ns characteristic symbol min typ max unit conditions
bbus compliant dual temperature monitor with beta compensation datasheet revision 1.1 (02-07-07) 6 smsc emc1212 datasheet figure 2.1 budgetbus bit timing t high t low t inactive t pwrdn t rise t fall '0' '1'
bbus compliant dual temperature monitor with beta compensation datasheet smsc emc1212 7 revision 1.1 (02-07-07) datasheet chapter 3 product description the emc1212 is a sot23 temperat ure sensor with a proprietary single wire smsc budgetbus? sensor interface. temperature information is commun icated to a host device via the serial bus. all intelligence regarding the interpretation of temper ature resides in the host. the emc1212 monitors an internal diode and single external transistor and automatically corrects for errors induced by series resistance and beta variation. figure 3.1 shows a typical system overview: thermal management consists of the host acquiring the temperat ure data from the emc1212 and controlling the speed of one or more fans. becaus e the emc1212 incorporates one internal and one external temperature diode, up to two separate thermal zones can be monitored and controlled. the host has the ability to compare meas ured temperature levels to preset limits and take the appropriate action when values are found to be out of limit. 3.1 power modes the emc1212 has two basic modes of operation that are controlled entirely by the host device. standby mode: the host can initiate standby mode by actively pul ling the bbus low. when the host places the device in standby mode, the device immediately powers down to draw < 2ua of supply current. it will remain in this state until it is awakened by the host. if the host pulls the bbus line low while temperature data is being clocked out, the device will not enter standby mode until completion of the data transfer. after entering standby mode, the device will remain in this mode until it is forced into active mode by the host. the transition from standby to active mode occurs when the host is no longer pulling the bbus low. active mode: the host initiates active mode by enabling a weak pull up on the bbus. in this mode, the emc1212 continuously converts temperature data. during the time that the device is actively converting a temperature, the bbus is in tri-st ate mode, and the host places a weak pull-up on the bus to prevent it from floating. after a conversion is completed, the device automatically clocks out the data from the most recent conversion to the host. when the da ta packet has been entirely clocked out, the bbus returns to tri-state mode, and the adc begins co nverting the next temperature sample. while bbus is in tri-state mode, the host can command the device to standby mode. figure 3.1 system diagram of emc1212 emc1212 host (e.g. kbc1122) bbus interface dp dn bbus
bbus compliant dual temperature monitor with beta compensation datasheet revision 1.1 (02-07-07) 8 smsc emc1212 datasheet 3.2 temperature monitor thermal diode temperature measurem ents are based on the change in forward bias voltage of a diode when operated at two or more different currents. as can be seen in this equation, the delta v be voltage is directly proportional to temperature. figure 3.2 shows a block diagram of the temperat ure monitoring circuitry. the delta v be is first sampled at an effective rate of 3.125khz and then measured by the internal 11 bit delta sigma adc. the advantages of this architecture over nyquist rate flash or sar converters are superb linearity and inherent noise immunity. the linearity can be di rectly attributed to the delta sigma adc single bit comparator while the noise immunity is achieved by the 20.75ms integration time. the input bandwidth of the system is fs/2048, th is translates to 50hz at a 100khz clock frequency. figure 3.2 block diagram of temperature monitoring the temperature data format is an offset 2?s complement with a range of -64c to +191.875c as shown in ta b l e 3 . 1 . where: k = boltzmann?s constant t = absolute temperature in kelvin q = electron charge = diode ideality factor table 3.1 emc1212 temperature data format temperature (c) 2?s complement format binary hex diode fault or -64 100 0000 0000 400h -63.875 100 0000 0001 401h -63 100 0000 1000 408h -1 110 1111 1000 6f8h 0 110 0000 0000 600h ? ? ? ? ? ? ? ? = ? = low high low be high be be i i q kt v v v ln _ _ cpu substrate pnp i low i high beta compensation circuitry resistance error correction input filter & sampler 11-bit delta-sigma adc
bbus compliant dual temperature monitor with beta compensation datasheet smsc emc1212 9 revision 1.1 (02-07-07) datasheet the external diode supported by the em c1212 must be connected as shown in figure 3.3 . the emc1202 availabe from smsc will support other diode configurations. 3.3 resistance error correction the emc1212 includes resistance error correction implemented in the analog front end of the chip. resistance error correction is an automatic feature that eliminates the need to characterize and compensate for the series resistance in the external diode lines. when using a temperature sensor t hat does not include resistance error correction, voltage developed across the parasitic resistance in the remote diode path produces an error in the reported temperature. the error introduced by this resistance is approxim ately 0.7c per ohm. sources of series resistance are pcb trace resistance, on die (i.e. on the processor) metal resistance, bulk resistance in the base and emitter of the te mperature transistor. 1 110 0000 1000 608h 63 111 1111 1000 7f8h 64 000 0000 0000 000h 65 000 0000 1000 008h 128 010 0000 0000 200h 191 011 1111 1000 3f8h 191.875 011 1111 1111 3ffh figure 3.3 external diode configuration table 3.1 emc1212 temperature data format (continued) temperature (c) 2?s complement format binary hex local ground to dp typical remote substrate transistor i.e. cpu substrate pnp to dn
bbus compliant dual temperature monitor with beta compensation datasheet revision 1.1 (02-07-07) 10 smsc emc1212 datasheet 3.4 beta compensation the beta compensation circuitry corrects for beta variation in pnp substrate transistors used as thermal diodes. the emc1212 is designed to work with 65nm processors manufactured by intel. for discrete transistors connected wit h collector to base as a diode, the beta is generally sufficiently high to make this relative beta va riation very small (a variation of 10% from low current to high current when beta = 50 contributes approx imately 0.25c error at 100c). however, for substrate transistors where the vbe junction is used for temperature measur ement and the collector is tied to the substrate, the proportional beta variation causes more error (a variation of 10% from low current to high current when beta = 0.5 contributes approximately 8.25c at 100c). because the beta compensation circuit is designed to work with pnp substrate transistors, the emc1212 should not be used with diode-connected tr ansistors (such as the 2n3904) or cpus that implement the thermal diode as a two-terminal diode. the beta compensation circuit is not present in the emc1202 availabe from smsc, and this devic e is an excellent companion to amd cpus. 3.5 conversion rate the conversion rate is fixed to the value given in section 2.2 , but conversions may be halted by periodically placing the device in standby as described in section 3.1, "power modes" .
bbus compliant dual temperature monitor with beta compensation datasheet smsc emc1212 11 revision 1.1 (02-07-07) datasheet chapter 4 typical operating curves to be determined based on characterization.
bbus compliant dual temperature monitor with beta compensation datasheet revision 1.1 (02-07-07) 12 smsc emc1212 datasheet chapter 5 package drawing figure 5.1 emc1212 package outline and parameters seating plane ccc c c detail "a" (scale: 2/1) gauge plane 0 0.25 h l l1 side view 3-d views in d ex area (d/2 x e1/2) 3 3 5 24 4 123 n4 6 n = 5 leads n = 6 leads notes: 1. "n" is the total number of leads . 2. true position spread tolerance is 0.10mm at maximum material condition. 3. package body dimension "d" does not include mold flash, protrusions or gate burrs. maximum mold flash, protrusions or gate burrs is 0.25 mm per end. dimension "e1" does not include interlead flash or protrusion. m axim u m in ter le ad fla sh o r pr ot ru sion is 0.25 mm per side. "d1" & "e1" d imensions are determined at datum plane "h". 4. dimensions "b" & "c" apply to the flat section of the lead between 0.08 to 0.15 m m f r om th e lead tip. 5. d et ails of pin 1 id en tif ier ar e o ption al, but must be located w ithin the index area indicated (see top view). 6. five lead package is a version of 6 lead package, where lead #5 has been removed from 6 lead package. d e e1 e 5x b see d etail "a" c top view end view a1 a2 a a initial release 7/07/04 s.k.iliev decimal x.x x.xx x.xxx material finish std c ompliance third angle projection p rint w ith "s cale to fit" do not scale drawing approved angular unless otherwise specified dimensions are in millime ters and tolerances are: d im and to l p er asm e y 14.5m - 1994 drawn checked name scale 80 arkay drive hauppauge, ny 11788 usa dwg number title date sheet rev revision history description revision released by date s.k.iliev s.k.iliev s.k.iliev 1 - - 0.025 0.05 0.1 7/07/04 1:1 7/06/04 7/06/04 a jedec: mo-178 / aa, ab 1 of 1 1.6mm body width, 0.95mm pitch package outline: 5/6 pin sot mo-5/6 sot-2.9x1.6
bbus compliant dual temperature monitor with beta compensation datasheet smsc emc1212 13 revision 1.1 (02-07-07) datasheet 5.1 package markings all devices will be marked on the top side with ?212? and a lead free symbol. on the bottom, they will be marked with yyww (2 digits for work week, 2 digits for year)

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